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Samsung's New Image Sensors Bring Fast and Slim Attributes to Mobile and IoT Applications
Samsung Electronics, a world leader in advanced semiconductor technology, today introduced two new ISOCELL image sensors: 1.28-micrometer (μm) 12-megapixel (Mp) ISOCELL Fast 2L9 with Dual Pixel technology, and ultra-small 0.9μm 24Mp ISOCELL Slim 2X7 with Tetracell technology. (...)
[WebWire Mobile communications]

Samsung's New Image Sensors Bring Fast and Slim Attributes to Mobile and IoT Applications
Samsung Electronics, a world leader in advanced semiconductor technology, today introduced two new ISOCELL image sensors: 1.28-micrometer (μm) 12-megapixel (Mp) ISOCELL Fast 2L9 with Dual Pixel technology, and ultra-small 0.9μm 24Mp ISOCELL Slim 2X7 with Tetracell technology. (...)
[WebWire Consumer electronics]

Apple: a semiconductor superpower in the making
Industry sources and analysts suggest that Apple is keen to expand its semiconductor capabilities further. They say the company is interested in building core processors for notebooks, modem chips for iPhones, and a chip that integrates touch, fingerprint and display driver functions. Apple is (...)
[OSNews]

SJSemi and Qualcomm Jointly Announce Qualification of 10nm Ultra-high Density Wafer Bumping Technology
SJ Semiconductor Corp. (SJSemi) and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, jointly announced that SJSemi has started the qualification of 10nm Ultra-high Density wafer bumping for Qualcomm Technologies. This represents SJSemi's further improvement in processing (...)
[WebWire Electronic components]

Afero® Launches Next Generation IoT Development Kit in Partnership with Semiconductor Leader Microchip
Afero, the next-generation IoT company with a fully integrated and highly secure edge-to-cloud platform, announced today the availability of the Afero Modulo-2â„¢, an IoT development kit with secure connectivity, secure data, and a highly productive development environment. The Afero Platformâ„¢ can (...)
[WebWire High tech security]

Samsung Strengthens Advanced Foundry Portfolio with New 11nm LPP and 7nm LPP with EUV Technology
Samsung Electronics, the world leader in advanced semiconductor technology, today announced it has added 11-nanometer (nm) FinFET process technology (11LPP, Low Power Plus) to its advanced foundry process portfolio, offering customers with an even wider range of options for their (...)
[WebWire Mobile communications]

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