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Atos delivers new quantum simulator to leading University in Austria
Atos, a global leader in digital transformation, announces a new contract with The University of Applied Sciences Upper Austria (FH Upper Austria) in Hagenberg for the latest version of its Atos Quantum Learning Machine, the world's highest-performing commercially available quantum simulator . (...)
[WebWire High tech security]

Atos delivers new quantum simulator to leading University in Austria
Atos, a global leader in digital transformation, announces a new contract with The University of Applied Sciences Upper Austria (FH Upper Austria) in Hagenberg for the latest version of its Atos Quantum Learning Machine, the world's highest-performing commercially available quantum simulator . (...)
[WebWire Computer hardware]

Digital all-round: the European research project iDev40 focuses on networking – from the idea and concept to the consumer
The European research project iDev40 (Integrated Development 4.0) is launched under the leadership of Infineon Austria. In this project, 38 partners from six countries will be involved in research on the smart networking of development and production processes for electronic components and (...)
[WebWire Mobile communications]

Digital all-round: the European research project iDev40 focuses on networking – from the idea and concept to the consumer
The European research project iDev40 (Integrated Development 4.0) is launched under the leadership of Infineon Austria. In this project, 38 partners from six countries will be involved in research on the smart networking of development and production processes for electronic components and (...)
[WebWire High tech security]

Infineon prepares for long-term growth and invests €1.6 billion in new 300-millimeter chip factory in Austria
Infineon Technologies AG is to build a new factory for power semiconductors. The market and technology leader in this segment will thereby create the foundation for long-term, profitable growth. A fully automated chip factory for manufacturing 300-millimeter thin wafers will be constructed at (...)
[WebWire Electronic components]

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